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Friday, June 30, 2006

Innovation alert :Greener Semiconductors

A new technique that replaces high temprature oxidation in silicon wafer fabrication with a room temprature process using UV light @ 126 nm wavelength, promises to revolutionize IC fabrication and bring down the power consumed for the same.

The BBC reports that
"The team from University College London used low temperature, ultraviolet lamps to make silicon dioxide, a vital component of almost all modern chips.
At the moment, chip makers use energy intensive furnaces, heated to more than 1000C, to manufacture the material.he new technique operates at room temperature and so requires less power and resources."

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